bzx84c2v4 - bzx84c51 document number: ds18001 rev. 32 - 2 1 of 5 www.diodes.com february 2014 ? diodes incorporated bzx84c2v4 - bzx84c51 350mw surface mount zener diode features ? planar die construction ? 350mw power dissipation ? zener voltages from 2.4v - 51v ? ideally suited for automated assembly processes ? totally lead-free & fully rohs compliant (notes 1 & 2) ? halogen and antimony free. ?green? device (note 3) ? qualified to aec-q101 standards for high reliability mechanical data ? case: sot23 ? case material: molded plastic. ul flammability classification rating 94v-0 ? moisture sensitivity: level 1 per j-std-020 ? terminals: matte tin finish annealed over alloy 42 leadframe (lead free plating). solderable per mil-std-202, method 208 ? polarity: see diagram ? weight: 0.008 grams (approximate) ordering information (note 5) part number compliance case packaging (type number)-7-f standard sot23 3,000/tape & reel (type number)q-7-f automotive sot23 3,000/tape & reel (type number)-13-f standard sot23 10,000/tape & reel (type number)q-13-f automotive sot23 10,000/tape & reel *for (type number), please see the el ectrical characteristics table. ex ample: 6.2v zener = bzx84c6v2-7-f. notes: 1. no purposely added lead. fully eu directiv e 2002/95/ec (rohs) & 2011/6 5/eu (rohs 2) compliant. 2. see http://www.diodes.com/quality/lead_free.html for more in formation about diodes incorporated?s definitions of halogen- a nd antimony-free, "green" and lead-free. 3. halogen- and antimony-free "green? products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total br + cl) and <1000ppm antimony compounds. 4. bzx84c2v4-bzx84c39 products manufactured with date code ow (week 42, 2009) and newer are built with green molding compound. bzx84c2v4- bzx84c39 products manufactured prior to date code ow are built with non-green molding compound and may contain halogens or sb 2 o 3 fire retardants. bzx84c43-bzx84c51 products manufactured with da te code v9 (week 33, 2008) and newer are built with green moldi ng compound. bzx84c43-bzx84c51 products manufactured prior to date code v9 are built with non-green molding compound and may contain hal ogens or sb 2 o 3 fire retardants. 5. for packaging details, go to our websit e at http://www.diodes.com /products/packages.html marking information date code key year 1998 ? 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 code j ? n p r s t u v w x y z a b c d e month jan feb mar apr may jun jul aug sep oct nov dec code 1 2 3 4 5 6 7 8 9 o n d top view device schematic sot23 xx = product type marking code (see electrical characteristics table) ym = date code marking for shanghai a ssembly / test site y = year (ex: z = 2012) m = month (ex: 9 = september) xx = product type marking code (see electrical characteristics table) = date code marking for chengdu a ssembly / test site = year (ex: z = 2012) m = month (ex: 9 = september) kxx ym e3 kxx ym y m y
bzx84c2v4 - bzx84c51 document number: ds18001 rev. 32 - 2 2 of 5 www.diodes.com february 2014 ? diodes incorporated bzx84c2v4 - bzx84c51 maximum ratings (@t a = +25c, unless otherwise specified.) characteristic symbol v alue unit forward voltage @ i f = 10ma v f 0.9 v thermal characteristics characteristic symbol v alue unit power dissipation (note 6) p d 300 mw power dissipation (note 7) p d 350 mw thermal resistance, junction to ambient air (note 6) r ja 417 c/w thermal resistance, junction to ambient air (note 7) r ja 357 c/w operating and storage temperature range t j, t stg -65 to +150 c electrical characteristics (@t a = +25c, unless otherwise specified.) type number marking code zener voltage range (note 8) maximum zener impedance f = 1khz maximum reverse current (note 8) temperature coefficient @ i zt mv/ c v z @ i zt i zt z zt @ i zt z zk @ i zk i r v r min max nom (v) min (v) max (v) (ma) ( ) ( ) (ma) (a) (v) bzx84c2v4 zb 2.4 2.2 2.6 5.0 100 600 1.0 50 1.0 -3.5 0 bzx84c2v7 zc 2.7 2.5 2.9 5.0 100 600 1.0 20 1.0 -3.5 0 bzx84c3v0 zd 3.0 2.8 3.2 5.0 95 600 1.0 10 1.0 -3.5 0 bzx84c3v3 ze 3.3 3.1 3.5 5.0 95 600 1.0 5.0 1.0 -3.5 0 bzx84c3v6 zf 3.6 3.4 3.8 5.0 90 600 1.0 5.0 1.0 -3.5 0 bzx84c3v9 zg 3.9 3.7 4.1 5.0 90 600 1.0 3.0 1.0 -3.5 0 bzx84c4v3 zh 4.3 4.0 4.6 5.0 90 600 1.0 3.0 1.0 -3.5 0 bzx84c4v7 z1 4.7 4.4 5.0 5.0 80 500 1.0 3.0 2.0 -3.5 0.2 bzx84c5v1 z2 5.1 4.8 5.4 5.0 60 480 1.0 2.0 2.0 -2.7 1.2 bzx84c5v6 z3 5.6 5.2 6.0 5.0 40 400 1.0 1.0 2.0 -2.0 2.5 bzx84c6v2 z4 6.2 5.8 6.6 5.0 10 150 1.0 3.0 4.0 0.4 3.7 bzx84c6v8 z5 6.8 6.4 7.2 5.0 15 80 1.0 2.0 4.0 1.2 4.5 bzx84c7v5 z6 7.5 7.0 7.9 5.0 15 80 1.0 1.0 5.0 2.5 5.3 bzx84c8v2 z7 8.2 7.7 8.7 5.0 15 80 1.0 0.7 5.0 3.2 6.2 bzx84c9v1 z8 9.1 8.5 9.6 5.0 15 100 1.0 0.5 6.0 3.8 7.0 bzx84c10 z9 10 9.4 10.6 5.0 20 150 1.0 0.2 7.0 4.5 8.0 bzx84c11 y1 11 10.4 11.6 5.0 20 150 1.0 0.1 8.0 5.4 9.0 bzx84c12 y2 12 11.4 12.7 5.0 25 150 1.0 0.1 8.0 6.0 10.0 bzx84c13 y3 13 12.4 14.1 5.0 30 170 1.0 0.1 8.0 7.0 11.0 bzx84c15 y4 15 13.8 15.6 5.0 30 200 1.0 0.1 10.5 9.2 13.0 bzx84c16 y5 16 15.3 17.1 5.0 40 200 1.0 0.1 11.2 10.4 14.0 bzx84c18 y6 18 16.8 19.1 5.0 45 225 1.0 0.1 12.6 12.4 16.0 bzx84c20 y7 20 18.8 21.2 5.0 55 225 1.0 0.1 14.0 14.4 18.0 bzx84c22 y8 22 20.8 23.3 5.0 55 250 1.0 0.1 15.4 16.4 - bzx84c24 y9 24 22.8 25.6 5.0 70 250 1.0 0.1 16.8 18.4 - bzx84c27 ya 27 25.1 28.9 2.0 80 300 0.5 0.1 18.9 21.4 - bzx84c30 yb 30 28.0 32.0 2.0 80 300 0.5 0.1 21.0 24.4 - bzx84c33 yc 33 31.0 35.0 2.0 80 325 0.5 0.1 23.1 27.4 - bzx84c36 yd 36 34.0 38.0 2.0 90 350 0.5 0.1 25.2 30.4 - bzx84c39 ye 39 37.0 41.0 2.0 130 350 0.5 0.1 27.3 33.4 - bzx84c43 yf 43 40.0 46.0 2.0 150 375 0.5 0.1 30.1 37.6 - bzx84c47 yg 47 44.0 50.0 2.0 170 375 0.5 0.1 32.9 42.0 - bzx84c51 yh 51 48.0 54.0 2.0 180 400 0.5 0.1 35.7 46.6 - notes: 6. device mounted on fr-4 pc board with recommended pad lay out, which can be found on our website at http://www.diodes.c om. 7. valid provided the terminals are kept at ambient temperature. 8. short duration pulse test used to minimize self-heating effect.
bzx84c2v4 - bzx84c51 document number: ds18001 rev. 32 - 2 3 of 5 www.diodes.com february 2014 ? diodes incorporated bzx84c2v4 - bzx84c51 400 t , ambient temperature, (c) fig. 1 power derating curve a p , p o we r dissi p a t i o n (mw) d 200 100 300 0 500 0 100 200 note 6 note 7 0 10 20 30 40 50 01 23456 7 8910 i, zene r c u r r en t (ma) z v , zener voltage (v) fig. 2 typical zener breakdown characteristics z 0 10 20 30 0 i, zene r c u r r en t (ma) z v , zener voltage (v) fig. 3 typical zener breakdown characteristics z 10 20 30 40 t = 25c j test current i 5ma z test current i 2ma z c10 c12 c18 c22 c27 c33 c36 c39 c15 0 2 4 6 8 10 10 0 20 30 40 50 60 70 i, ze n e r c u r r e n t (ma) z v , zener voltage (v) fig. 4 typical zener breakdown characteristics z t = 25c j test current i 2ma z c43 c47 c51 c , total capacitance (pf) t 10 100 1,000 10 100 1 v , nominal zener voltage (v) fig. 5 typical total capacitance vs. nominal zener voltage z t = 25c j v = 1v r v = 2v r v = 1v r v = 2v r c , total capacitance (pf) t 1 10 100 100 10 v , nominal zener voltage (v) fig. 6 typical total capacitance vs. nominal zener voltage z
bzx84c2v4 - bzx84c51 document number: ds18001 rev. 32 - 2 4 of 5 www.diodes.com february 2014 ? diodes incorporated bzx84c2v4 - bzx84c51 package outline dimensions please see ap02002 at http://www.diodes.com /datasheets/ap02002.pdf for latest version. suggested pad layout please see ap02001 at http://www.diodes.com /datasheets/ap02001.pdf for latest version. sot23 dim min max typ a 0.37 0.51 0.40 b 1.20 1.40 1.30 c 2.30 2.50 2.40 d 0.89 1.03 0.915 f 0.45 0.60 0.535 g 1.78 2.05 1.83 h 2.80 3.00 2.90 j 0.013 0.10 0.05 k 0.903 1.10 1.00 k1 - - 0.400 l 0.45 0.61 0.55 m 0.085 0.18 0.11 0 8 - all dimensions in mm dimensions value (in mm) z 2.9 x 0.8 y 0.9 c 2.0 e 1.35 x e y c z a m j l d f b c h k g k1
bzx84c2v4 - bzx84c51 document number: ds18001 rev. 32 - 2 5 of 5 www.diodes.com february 2014 ? diodes incorporated bzx84c2v4 - bzx84c51 important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. diodes incorporated does not assume any liability ari sing out of the application or use of this document or an y product described herein; neither does di odes incorporated convey any license under its patent or trademark rights, nor the rights of others. any customer or us er of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability w hatsoever in respect of any products purchased through unauthoriz ed sales channel. should customers purchase or use diodes inco rporated products for any unintended or una uthorized application, customers shall i ndemnify and hold diodes incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death a ssociated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more united states, international or foreign trademarks. this document is written in english but may be translated into multiple languages for reference. only the english version of t his document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critical component s in life support devices or systems without the express written approval of the chief executive offi cer of diodes incorporated. as used herein: a. life support devices or syst ems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-rel ated requirements concerning the ir products and any use of diodes incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporate d and its representatives against any damages arisi ng out of the use of diodes incorporated pr oducts in such safety-critical, life suppor t devices or systems. copyright ? 2014, diodes incorporated www.diodes.com
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